Kistler components and systems are easily integrated into assembly lines. The portfolio ranges from individual sensors and process monitoring systems to NC joining systems (servo presses) as well as turnkey press-fit and test cells (Smart Single Stations). These solutions give users a high degree of flexibility so they can adapt to rapid changes in the market at any time.
Solderless press-fit joints are highly reliable and safe against external influences such as vibrations, impacts or shocks. Thanks to these advantages, press-fit technology (also: cold welding) is the fastening technology of choice for a number of assembly operations involved in the manufacture of products in the 3C industries – the computer, communication and consumer electronics sectors.
For example: the press-fit method is used to assemble printed circuit boards (PCBs) with power electronics and connectors for circuit boards; it is also used in board-to-board assembly of PCBs (backplanes or back panels). Performing these complex press-fit processes to high standards of quality and efficiency presents a challenge: how can force and positioning be controlled with precision? The same issue arises with display bonding processes to join particularly sensitive materials and components such as glass and touch sensors: here too, it is essential to apply the required press forces with maximum precision and repeat accuracy.
