Force is a critical factor in numerous semiconductor manufacturing processes. Deviations can lead to damages in microchips, internal fractures and defective products. Learn how force can be measured, monitored and controlled with piezoelectric force sensors.

This webinar is relevant for the following semiconductor manufacturing processes:

• Thermal compression bonding
• Pick and place
• Die bonding
• Wafer manufacturing
• Join our webinar and find out how this is possible.